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hwinfo: Bump to 22.2

This commit is contained in:
Tee KOBAYASHI 2023-01-10 03:47:22 +09:00 committed by xtkoba
parent ef29e1dd3b
commit 9641196f11
1 changed files with 2 additions and 3 deletions
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root-packages/hwinfo/build.sh
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@ -2,10 +2,9 @@ TERMUX_PKG_HOMEPAGE=https://github.com/openSUSE/hwinfo
TERMUX_PKG_DESCRIPTION="Hardware detection tool from openSUSE"
TERMUX_PKG_LICENSE="GPL-2.0"
TERMUX_PKG_MAINTAINER="@termux"
TERMUX_PKG_VERSION=22.1
TERMUX_PKG_REVISION=1
TERMUX_PKG_VERSION=22.2
TERMUX_PKG_SRCURL=https://github.com/openSUSE/hwinfo/archive/$TERMUX_PKG_VERSION.tar.gz
TERMUX_PKG_SHA256=58fd8ed9b704e4622f5ae28e0b240f905516c255c7d2695169fb2b9dd6d549a9
TERMUX_PKG_SHA256=53f55f9072f0dddf36439645e70fda82431327cd2262a741390af4bd665b6713
TERMUX_PKG_DEPENDS="libandroid-shmem, libuuid (>> 2.38.1), libx86emu"
TERMUX_PKG_BREAKS="hwinfo-dev"
TERMUX_PKG_REPLACES="hwinfo-dev"